TEI 2026
VISIT THE OFFICIAL WEBSITE HERE FOR ALL EVENT INFORMATION
TEI’26 is the 20th annual conference that presents the latest results in tangible, embedded, and embodied interaction. The ACM TEI conference has gained substantial visibility and activity over the past decade, resulting in outstanding works from past conferences. TEI brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, computer science, product design, media studies and the arts. TEI’26, will take place March 8-11, 2026 in Chicago, Illinois, USA.
TEI ’26 is planned as a hybrid conference, allowing remote participants to present and attend portions of the program. However, only in-person attendance will offer the full ‘tangible and embodied’ experience. More details for each track and program will be provided at a later date.
Theme – ‘Tide + Tied’
As TEI’26 marks the 20th TEI conference and its return to North America after seven years, the theme ‘Tide + Tied’ captures the essence of resurgence and convergence at the core value of the TEI community. Set against the backdrop of Chicago, where towering architecture meets expansive lakeshores, the conference explores the seamless integration of the digital and physical, the interplay of technology and humanity, and the urban intermingling with the natural environment. By becoming a venue to bring multi-folded ‘Tides’ across diverse, interdisciplinary fields, the conference aims to bring researchers, designers, and artists with different backgrounds and interests together to be ‘Tied,’ weaving the future of the TEI community together.
